ESDA17P50-1U1M Ver la hoja de datos (PDF) - STMicroelectronics

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Fabricante

ESDA17P50-1U1M

High power transient voltage suppressor

STMicroelectronics 

ESDA17P50-1U1M

Recommendation on PCB assembly

3

Recommendation on PCB assembly

3.1

Stencil opening design

1. General recommendation on stencil opening design

a. Stencil opening dimensions: L (Length), W (Width), T (Thickness).

2. General design rule

a. Stencil thickness (T) = 75 ~ 125 μm

b. Aspect ratio = �� ≥ 1.5

��

c.

Aspect

area

=

����

2��(��+��)

≥

0.66

3. Reference design

a. Stencil opening thickness: 100 μm

b. Stencil opening for leads: Opening to footprint ratio is 90%.

Figure 14: Stencil opening dimensions

L

TW

Figure 15: Recommended stencil window position

Figure 16: Alternative stencil window position

3.2

Solder paste

1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.

2. “No clean” solder paste is recommended.

3. Offers a high tack force to resist component movement during PCB movement.

4. Solder paste with fine particles: powder particle size is 20-45 μm.

Doc029464 Rev 1

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