MC100LVE164 Ver la hoja de datos (PDF) - Motorola => Freescale
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MC100LVE164 Datasheet PDF : 4 Pages
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MC100LVE164
A
A1
32
OUTLINE DIMENSIONS
FA SUFFIX
TQFP PACKAGE
CASE 873A-02
ISSUE A
4X
0.20 (0.008) AB T–U Z
25
1
–T–
B
B1
8
DETAIL Y
–U–
V
17 V1
9
–Z–
4X
9
S1
0.20 (0.008) AC T–U Z
S
–AB–
SEATING
PLANE
–AC–
G
0.10 (0.004) AC
8X M_
R
CE
DETAIL AD
ÉÉBASE
METAL
ÉÉN
ÉÉÉÉÉÉÉÉ F
D
J
SECTION AE–AE
W
H
K Q_
X
DETAIL AD
AE
P
AE
DETAIL Y
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4 DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5 DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8 MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9 EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 7.000 BSC
0.276 BSC
A1 3.500 BSC
0.138 BSC
B 7.000 BSC
0.276 BSC
B1 3.500 BSC
0.138 BSC
C 1.400 1.600 0.055 0.063
D 0.300 0.450 0.012 0.018
E 1.350 1.450 0.053 0.057
F 0.300 0.400 0.012 0.016
G 0.800 BSC
0.031 BSC
H 0.050 0.150 0.002 0.006
J 0.090 0.200 0.004 0.008
K 0.500 0.700 0.020 0.028
M
12_ REF
12_ REF
N 0.090 0.160 0.004 0.006
P 0.400 BSC
0.016 BSC
Q
1_
5_ 1_
5_
R 0.150 0.250 0.006 0.010
S 9.000 BSC
0.354 BSC
S1 4.500 BSC
0.177 BSC
V 9.000 BSC
0.354 BSC
V1 4.500 BSC
0.177 BSC
W 0.200 REF
0.008 REF
X 1.000 REF
0.039 REF
ECLinPS and ECLinPS Lite
4–3
DL140 — Rev 3
MOTOROLA
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