LB1860, LB1860M, LB1861, LB1861M
Package Dimensions
unit : mm
[LB1860M, LB1861M]
SOIC14 W / MFP14S (225 mil)
CASE 751CB
ISSUE A
to
SOLDERING FOOTPRINT*
(Unit: mm)
1.00
0.47
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
GENERIC
MARKING DIAGRAM*
XXXXXXXXXX
YMDDD
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
*This information is generic. Please refer to
device data sheet for actual part marking.
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