20. THERMAL INFORMATION
DS3251/DS3252/DS3253/DS3254
Table 20-A. Thermal Properties, Natural Convection
PARAMETER
MIN
Ambient Temperature (Note 1)
-40°C
Junction Temperature
-40°C
Theta-JA (θJA), Still Air (Note 2)
Psi-JB
Psi-JT
TYP
—
—
22.4°C/W
9.2°C/W
1.6°C/W
MAX
+85°C
+125°C
Note 1: The package is mounted on a four-layer JEDEC standard test board with no airflow and dissipating maximum power.
Note 2: Theta-JA (θJA) is the junction to ambient thermal resistance, when the package is mounted on a four-layer JEDEC standard test board
with no airflow and dissipating maximum power.
Table 20-B. Theta-JA (θJA) vs. Airflow
FORCED AIR (METERS PER
SECOND)
THETA-JA (θJA)
0
22.4°C/W
1
19.0°C/W
2.5
17.2°C/W
21. REVISION HISTORY
REVISION
031805 New Product Release (DS3254)
DESCRIPTION
061705
030106
New Product Release (DS3251/DS3252/DS3253)
Added requirement that ALE pin must be high when using the SPI interface: Figure 4-1 (at the
bottom), the second paragraph of Section 5, Table 6-F, the first paragraph of Section 15.2,
Table 18-A, Figure 18-3, Figure 18-6, Figure 18-9, and Figure 18-12.
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