POWER-DOWN/POWER-UP CONDITION, 3.3V
DS1244/DS1244P
256k NV SRAM
with Phantom Clock
AC TEST CONDITIONS
Output Load:
Input Pulse Levels:
50pF +1TTL Gate
0 to 3V
Timing Measurement Reference Levels
Input: 1.5V
Output: 1.5V
Input Pulse Rise and Fall Times: 5ns
NOTES:
1)
is high for a read cycle.
2)
= VIH or VIL. If = VIH during write cycle, the output buffers remain in a high-impedance state.
3) tWP is specified as the logical AND of
and . tWP is measured from the latter of
or going low to the earlier of
or going high.
4) tDH, tDS are measured from the earlier of
or going high.
5) These parameters are sampled with a 50pF load and are not 100% tested.
6) If the
low transition occurs simultaneously with or later than the low transition in Write Cycle 1, the output buffers
remain in a high-impedance state during this period.
7) If the
high transition occurs prior to or simultaneously with the high transition, the output buffers remain in a
high-impedance state during this period.
8) If is low or the low transition occurs prior to or simultaneously with the
low transition the output buffers remain in
a high impedance state during this period.
9) The expected tDR is defined as cumulative time in the absence of Vcc with the clock oscillator running.
10) tWR is a function of the latter occurring edge of or .
11) Voltages are referenced to ground.
12)
(Pin 1) has an internal pullup resistor.
13) RTC modules can be successfully processed through conventional wave-soldering techniques as long as temperature
exposure to the lithium energy source contained within does not exceed +85℃. Post solder cleaning with water-washing
techniques is acceptable, provided that ultrasonic vibration is not used.
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