MPX4100AP Ver la hoja de datos (PDF) - Motorola => Freescale

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MPX4100AP

Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Motorola => Freescale 

MPX4100A MPXA4100A SERIES

INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must

be the correct size to ensure proper solder connection inter-

face between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and short-

ing between solder pads.

0.660

16.76

0.100 TYP 8X

2.54

0.060 TYP 8X

1.52

0.300

7.62

0.100 TYP 8X

2.54

inch

mm SCALE 2:1

Figure 5. SOP Footprint (Case 482)

6

Motorola Sensor Device Data

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