Description:
This N-Channel MOSFET uses advanced trench technology and
design to provide excellent RDS(on) with low gate charge.
It can be used in a wide variety of applications.
Features:
1) VDS=900V,ID=2A,RDS(ON)<6Ω@VGS=10V
2) Low gate charge.
3) Green device available.
4) Advanced high cell denity trench technology for ultra Iow RDS(ON).
5) Excellent package for good heat dissipation.
CEU02N9
D
G
S
Absolute Maximum Ratings:(TA=25℃ unless otherwise noted)
Symbol
VDS
VGS
ID
EAS
IAR
PD
TJ, TSTG
TL
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current-TJ=25℃
Continuous Drain Current-TJ=100℃
Single Pulse Avalanche Energy(note1)
Avalanche Current(note2)
Power Dissipation, TJ=25℃
Operating and Storage Junction Temperature Range
Maximum lead temperature for soldering purpose,1/8”
from case for 5 seconds
Ratings
900
±30
2
1.25
180
2
80
-55 to +150
300
Thermal Characteristics:
Symbol
Parameter
Max
RƟJC
Thermal Resistance,Junction to Case
1.14
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— 1—
Units
V
V
A
mJ
A
W
℃
℃
Units
℃/W