R6012JNJ
lThermal resistance
Parameter
Thermal resistance, junction - case
Thermal resistance, junction - ambient
Soldering temperature, wavesoldering for 10s
Datasheet
Symbol
RthJC
RthJA
Tsold
Values
Unit
Min. Typ. Max.
-
- 0.78 ℃/W
-
- 80 ℃/W
-
- 265 ℃
lElectrical characteristics (Ta = 25°C)
Parameter
Symbol
Conditions
Drain - Source breakdown
voltage
Zero gate voltage
drain current
Gate - Source leakage current
Gate threshold voltage
Static drain - source
on - state resistance
Gate resistance
V(BR)DSS VGS = 0V, ID = 1mA
VDS = 600V, VGS = 0V
IDSS
Tj = 25°C
IGSS VGS = ±30V, VDS = 0V
VGS(th) VDS = VGS, ID = 2.5mA
RDS(on)*5 VGS = 15V, ID = 6.0A
Tj = 25°C
RG f = 1MHz, open drain
Values
Unit
Min. Typ. Max.
600 -
-
V
-
- 100 μA
-
- ±100 nA
5.0 6.0 7.0 V
- 0.300 0.390 Ω
- 2.2 - Ω
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20190527 - Rev.002