STB85NF55T4, STP85NF55
Electrical characteristics
2
Electrical characteristics
TCASE = 25 °C unless otherwise specified
Table 3. On/off states
Symbol
Parameter
Test conditions
V(BR)DSS
Drain-source breakdown voltage VGS = 0 V, ID = 250 μA
IDSS
Zero gate voltage drain current
VGS = 0 V, VDS = 55 V
VGS = 0 V, VDS= 55 V
TC = 125 °C (1)
IGSS
Gate body leakage current
VDS = 0 V, VGS = ±20 V
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 250 µA
RDS(on)
Static drain-source on-resistance VGS = 10 V, ID = 40 A
1. Defined by design, not subject to production test.
Min. Typ. Max. Unit
55
V
1
µA
10
µA
±100 nA
2
3
4
V
6.2
8.0
mΩ
Table 4. Dynamic
Symbol
Parameter
Test conditions
Min. Typ. Max. Unit
gfs (1)
Ciss
Coss
Crss
Qg
Qgs
Qgd
Forward transconductance
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Gate-source charge
Gate-drain charge
VDS = 15 V, ID = 40 A
-
VDS = 25 V, f = 1 MHz,
-
VGS = 0 V
-
VDD = 30 V, ID = 80 A,
-
VGS = 0 to 10 V
-
(see Figure 14. Test circuit for gate
charge behavior)
-
120
S
3700
pF
900
pF
310
pF
120
150
nC
30
nC
45
nC
1. Pulsed: pulse duration=300 μs, duty cycle 1.5%
Symbol
td(on)
tr
td(off)
tf
Parameter
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Table 5. Switching times
Test conditions
Min. Typ. Max. Unit
VDD = 30 V, ID = 40 A,
-
25
-
ns
RG = 4.7 Ω, VGS = 10 V
-
100
-
ns
(see Figure 13. Test circuit for
-
70
-
ns
resistive load switching times and
Figure 18. Switching time
waveform)
-
35
-
ns
DS2569 - Rev 12
page 3/18