A610 データシートの表示（PDF） - Intel
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A610 Datasheet PDF : 48 Pages
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PENTIUM® PROCESSOR (610\75)
Table 21. Thermal Resistance vs. Copper Plane
Thickness with and without Enhancements
Copper
Plane
Thickness*
θCA (°C/W)
No
Enhancements
θCA (°C/W)
With
Heat Pipe
1 oz. Cu
18
8
3 oz. Cu
14
8
NOTES:
*225 vias underneath the die
(1 oz = 1.3 ml)
Table 22. Thermal Resistance vs. Thermal Vias
underneath the Die
No. of Vias Under
the Die*
0
θCA (°C/W)
No Enhancements
15
144
13
NOTE:
*3 oz. copper planes in test boards
6.4.1. STANDARD TEST BOARD
CONFIGURATION
All Tape Carrier Package (TCP) thermal
measurements provided in the following tables were
taken with the component soldered to a 2" x 2" test
board outline. This six-layer board contains 225
vias (underneath the die) in the die attach pad
which are connected to two 3 oz. copper planes
located at layers two and five. For the Pentium
processor (610\75) TCP, the vias in the die attach
pad should be connected without thermal reliefs to
the ground plane(s). The die is attached to the die
attach pad using a thermally and electrically
conductive adhesive. This test board was designed
to optimize the heat spreading into the board and
the heat transfer through to the opposite side of the
board.
NOTE
Thermal resistance values should be used
as guidelines only, and are highly system
dependent. Final system verification should
always refer to the case temperature
specification.
Table 23. Pentium® Processor (610\75)
TCP Package Thermal Resistance
without Enhancements
θJC
(°C/W)
θCA
(°C/W)
Thermal Resistance without .8
13.9
Enhancements
Table 24. Pentium® Processor (610\75)
TCP Package Thermal Resistance
with Enhancements (without Airflow)
Thermal
θCA
Enhancements
(°C/W)
Notes
Heat sink
11.7
1.2"×1.2"×.35"
Al Plate
8.7
4"×4"×.030"
Al Plate with
7.8
Heat Pipe
.3×1"×4"
Table 25. Pentium® Processor (610\75)
TCP Package Thermal Resistance
with Enhancements (with Airflow)
Thermal
θCA
Enhancements (°C/W)
Notes
Heat sink with Fan 5.0
@ 1.7 CFM
1.2"×1.2"×.35" HS
1"×1"×.4" Fan
Heat sink with
5.1
Airflow @ 400 LFM
1.2"×1.2"×.35" HS
Heat sink with
4.3
Airflow @ 600 LFM
1.2"×1.2"×.35" HS
HS = heat sink
LFM = Linear Feet/Minute
CFM = Cubic Feet/Minute
46
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