HCTS163D/SAMPLE データシートの表示（PDF） - Intersil
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HCTS163D/SAMPLE Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
104 x 86 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
< 2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS163MS
HCTS163MS
CP
MR
VCC
(2)
(1)
(16)
P0 (3)
P1 (4)
P2 (5)
P3 (6)
(15) TC
(14) Q0
(13) Q1
(12) Q2
PE (7)
(11) Q3
(8)
(9)
(10)
GND
SPE
TE
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS163 is TA14448A.
Spec Number 518600
578
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