QSB363CZR データシートの表示（PDF） - Fairchild Semiconductor

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QSB363CZR

Subminiature Plastic Silicon Infrared Phototransistor

Fairchild Semiconductor 

Package Dimensions

Features

■ Three lead forming options: Gull Wing, Yoke and Z-Bend

■ Compatible with automatic placement equipment

■ Supplied on tape and reel or in bulk packaging

■ Compatible with vapor phase reflow solder processes

Gull Wing Lead Configuration

Z-Bend Lead Configuration

ø0.075±0.008

(ø1.9±0.2)

0.098±0.004

(2.5±0.1)

CL

Emitter

ø0.075±0.008

(1.9±0.2)

0.098±0.004

(2.5±0.1)

CL

Emitter

0.157±0.008

(4.0±0.2)

0.043±0.008 0.055±0.008

(1.1±0.2) (1.4±0.2)

R0.031±.004

(0.8±0.1)

0.051±0.004

(1.3±0.1)

0.043±0.008 0.055±0.008

R0.031±.004 (1.1±0.2) (1.4±0.2)

(0.8±0.1)

0.051±0.004

(1.3±0.1)

0.032

+0.005

–0

(0.83

+0.13

–0

)

0.012±0.004

(0.3±0.1)

0.029±0.004

(0.75±0.1)

0.055±0.004

(1.4±0.1)

Yoke Lead Configuration

ø0.075±0.008

(1.9±0.2)

0.098±0.004

(2.5±0.1)

CL

Emitter

0.023

+0.005

–0

(0.6

+0.13

–0

)

0.12±0.008

(3.05±0.2)

0.169±0.008 (4.3±0.2)

0.228±0.008 (5.8±0.2)

0.055±0.004

(1.4±0.1)

0.029±0.004

(0.75±0.1)

R0.016±.004

(0.4±0.1)

0.043±0.008 0.055±0.008

(1.1±0.2) (1.4±0.2)

R0.031±.004

(0.8±0.1)

0.051±0.004

(1.3±0.1)

0.185±0.008 (4.7±0.2)

0.291±0.008 (7.4±0.2)

0.029±0.004

(0.75±0.1)

0.055±0.004

(1.4±0.1)

©2011 Fairchild Semiconductor Corporation

QSB363C Rev. 1.0.3

4

www.fairchildsemi.com

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