CXD1250M データシートの表示（PDF） - Sony Semiconductor
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CXD1250M Datasheet PDF : 7 Pages
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Package Outline
Unit: mm
CXD1250M
20PIN SOP (PLASTIC) 300mil
+ 0.4
12.45 – 0.1
20
11
+ 0.4
1.85 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
10
1.27
+ 0.1
0.2 – 0.05
± 0.12 M
CXD1250N
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-20P-L01
∗SOP020-P-0300-A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY / PHENOL RESIN
SOLDER PLATING
COPPER ALLOY
0.3g
20PIN SSOP (PLASTIC)
∗6.5 ± 0.1
20
11
A
+ 0.2
1.25 – 0.1
0.1
1
+ 0.1
0.22 – 0.05
10
0.65 ± 0.12
+ 0.05
0.15 – 0.02
0.1 ± 0.1
0° to 10°
NOTE: Dimension “∗” does not include mold protrusion.
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
SSOP-20P-L01
SSOP020-P-0044
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER / PALLADIUM
PLATING
COPPER / 42 ALLOY
PACKAGE WEIGHT
0.1g
–7–
CXD1250M/N
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