Pad Assignment
Pad No.
1
2
3
X
–28.2
–7.55
–30.1
Chip size: 76 × 50 (mil)2
*The IC substrate should be connected to VDD in the PCB layout artwork.
Block Diagram
HT10XX
Unit:mil
Y
16.6
16.7
16.6
Absolute Maximum Ratings
Supply Voltage ............................... –0.3V to 13V
Power Dissipation...................................250mW
Storage Temperature................. –50°C to 125°C
Operating Temperature................... 0°C to 70°C
2
3rd Oct ’96