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PBL38772/1 データシートの表示(PDF) - Ericsson

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PBL38772/1 Datasheet PDF : 24 Pages
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PBL 387 72
Power-up Sequence
No special power-up sequence is necessary except that
ground has to be present before all other power supply
voltages. The digital inputs C1, C2 and C3 are internal pull-up
terminals.
Printed Circuit Board Layout
Care in Printed Circuit Board (PCB) layout is essential for
proper function. The components connection RSN input
should be placed in close proximity to that pin, such that no
interference is injected into the receive summing node (RSN).
Ground plane surrounding the RSN pin is advisable. Analog
Ground (AGND should be connected to Battery Ground
(BGND near the SLIC package. RLC and RREF should be
connected to AGND with short leads. Pin LP and HP are
sensitive to leakage currents. The CLP connection between
pins LP and VTBAT should be as short as possible. CB and
CTB must be connected near the pins VBAT and VTBAT
with short vias to ground. The batwing pins are internally
connected to VBAT and used for transferring the heat from
the chip to the printed circuit board. It is therefore advisable
to implement a PCB layout that facilitates heat conduction
away from the batwing pins.
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EN/LZT 146 136 R1A © Ericsson Microelectronics, December 2001

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