GB50YF120N
IGBT Fourpack Module, 50 A Vishay High Power Products
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
MIN.
Junction to case IGBT
Junction to case DIODE
Case to sink, flat, greased surface
Mounting torque (M5)
RthJC (IGBT)
-
RthJC (DIODE)
-
RthCS (MODULE)
-
2.7
Weight
-
TYP.
-
-
0.05
-
170
MAX.
0.38
1.00
-
3.3
-
UNITS
°C/W
Nm
g
160
140
120
100
80
60
40
20
0
0
10 20 30 40 50 60 70
TC (°C)
Fig. 1 - Maximum DC Collector Current vs.
Case Temperature
350
300
250
200
150
100
50
0
0 20 40 60 80 100 120 140 160
TC (°C)
Fig. 2 - Power Dissipation vs. Case Temperature
1000
100
10
1
0.1
0.01
1
1000
10
100
1000
VCE (V)
Fig. 3 - Forward SOA
TC = 25 °C; TJ ≤ 150 °C
10000
100
10
1
10
100
1000
10000
TC (°C)
Fig. 4 - Reverse Bias SOA
TJ = 150 °C; VGE = 15 V
Document Number: 93653
Revision: 01-Sep-08
For technical questions, contact: ind-modules@vishay.com
www.vishay.com
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