HCTS132K データシートの表示（PDF） - Intersil
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HCTS132K Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
90 x 90 mils
2.29 x 2.29mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
B1
(2)
HCTS132MS
HCTS132MS
A1
VCC
B4
(1)
(14)
(13)
Y1 (3)
A2 (4)
B2 (5)
NC
NC
(12) A4
(11) Y4
(10) B3
(6)
(7)
Y2
GND
(8)
(9)
Y3
A3
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS132 is TA14483A.
507
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