DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

MAX6639 データシートの表示(PDF) - Maxim Integrated

部品番号
コンポーネント説明
メーカー
MAX6639 Datasheet PDF : 22 Pages
First Prev 11 12 13 14 15 16 17 18 19 20 Next Last
MAX6639/MAX6639F
2-Channel Temperature Monitor with Dual,
Automatic, PWM Fan-Speed Controller
Typical Operating Circuit
5V
VFAN
(5V OR 12V)
3.0V TO 3.6V
5V
CPU
VCC ADD TACH1
DXP1
VFAN
(5V OR 12V)
DXN
PWM1
5V
DXP2
PWM2
MAX6639
3.3V TO 5.5V
GPU
TO SMBus
SDA
MASTER
SCL
3.3V TO 5.5V
TACH2
3.3V TO 5.5V
ALERT
3.3V TO 5.5V
OT
TO SYSTEM SHUTDOWN
3.3V TO 5.5V
TO CLOCK THROTTLE
THERM
FANFAIL
GND
3) Route the DXP and DXN traces parallel and close to
each other, away from any high-voltage traces such
as +12VDC. Avoid leakage currents from PCB cont-
amination. A 20MΩ leakage path from DXP ground
causes approximately +1°C error.
4) Connect guard traces to GND on either side of the
DXP/DXN traces. With guard traces, placing routing
near high-voltage traces is no longer an issue.
5) Route as few vias and crossunders as possible to
minimize copper/solder thermocouple effects.
6) When introducing a thermocouple, make sure that
both the DXP and the DXN paths have matching
thermocouples. In general, PCB-induced thermo-
couples are not a serious problem. A copper solder
thermocouple exhibits 3µV/°C, and it takes approxi-
mately 200µV of voltage error at DXP/DXN to cause
a +1°C measurement error, so most parasitic ther-
mocouple errors are swamped out.
7) Use wide traces. Narrow traces are more inductive
and tend to pick up radiated noise. The 10-mil widths
and spacings recommended are not absolutely nec-
essary (as they offer only a minor improvement in
leakage and noise), but use them where practical.
8) Placing an electrically clean copper ground plane
between the DXP/DXN traces and traces carrying
high-frequency noise signals helps reduce EMI.
20
Maxim Integrated

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]