MPXH6101A データシートの表示（PDF） - Freescale Semiconductor

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MPXH6101A

Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

INFORMATION FOR USING THE SMALL OUTLINE PACKAGES

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

between the board and the package. With the correct

shorting between solder pads.

0.660

16.76

0.100 TYP 8X

2.54

0.060 TYP 8X

1.52

0.300

7.62

0.100 TYP 8X

2.54

inch

mm SCALE 2:1

Figure 5. SOP Footprint (Case 482)

0.150

3.81

0.050

1.27

TYP

0.387

9.83

0.027 TYP 8X

0.69

0.053 TYP 8X

inch

1.35

mm

Figure 6. SSOP Footprint (Case 1317)

MPX4101A

6

Sensors

Freescale Semiconductor

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