Table 2. STM32F405xx and STM32F407xx: features and peripheral counts
Peripherals
STM32F405RG STM32F405OG STM32F405VG STM32F405ZG STM32F405OE STM32F407Vx STM32F407Zx STM32F407Ix
SPI / I2S
I2C
3/2 (full duplex)(2)
3
USART/
UART
4/2
Communi
cation
interfaces
USB
OTG FS
Yes
USB
OTG HS
Yes
CAN
2
SDIO
Yes
Camera interface
No
Yes
GPIOs
51
72
82
114
72
82
114
140
12-bit ADC
3
Number of channels
16
13
16
24
13
16
24
24
12-bit DAC
Yes
Number of channels
2
Maximum CPU
frequency
Operating voltage
168 MHz
1.8 to 3.6 V(3)
Operating
temperatures
Ambient temperatures: –40 to +85 °C /–40 to +105 °C
Junction temperature: –40 to + 125 °C
Package
LQFP64
WLCSP90
LQFP100
LQFP144
WLCSP90
LQFP100
LQFP144
UFBGA176
LQFP176
1. For the LQFP100 and WLCSP90 packages, only FSMC Bank1 or Bank2 are available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip
Select. Bank2 can only support a 16- or 8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available in this
package.
2. The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode.
3. VSeDcDt/iVoDnD:AInmteinrnimalurmesveat lOueFFo)f.1.7 V is obtained when the device operates in reduced temperature range, and with the use of an external power supply supervisor (refer to