35XS3500(2011) データシートの表示（PDF） - Freescale Semiconductor
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35XS3500 Datasheet PDF : 41 Pages
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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Over-voltage Test Range
Maximum Operation Voltage
Load Dump (400 ms) @ 25 °C
VBAT
V
28
40
Reverse Polarity Voltage Range
2.0 Min @ 25 °C
VBAT
V
- 18
VCC Supply Voltage
Output Voltage
Positive
Negative (ground disconnected)
VCC
VOUT
-0.3 to 5.5
V
V
40
-16
Digital Input Current in Clamping Mode (SI, SCLK, CS, IGN, FLASHER,
IIN
STOP, LIMP)
±1.0
mA
FETIN Input Current
IFETIN
+10
mA
-1.0
SO and FETOUT Output Voltage
Outputs clamp energy using single pulse method (L = 2.0 mH; R = 0 Ω;
VBAT = 14 V @ 150 °C initial)
ESD Voltage(2)
Human Body Model (HBM) OUT[1:5], VPWR, and GND
Charge Device Model (CDM)
Corner Pins (1,13,19,21)
All Other Pins (2-12, 14-18, 20, 22-24)
VSO
E
VESD
- 0.3 to VCC + 0.3
V
30
mJ
V
± 2000
± 8000
± 750
± 500
THERMAL RATINGS
Operating Temperature
Ambient
Junction
Peak Pin Reflow Temperature During Solder Mounting(3)
TA
TJ
TSOLDER
°C
- 40 to 125
- 40 to 150
260
°C
Storage Temperature
TSTG
- 55 to 150
°C
THERMAL RESISTANCE
Thermal Resistance, Junction to Case(4)
RθJC
1.0
°C/W
Notes
2. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω) and the Charge Device
Model.
3. Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device. If the qualification fails, TSOLDER will be changed for 240 °C.
4. Typical value is guaranteed per design.
Analog Integrated Circuit Device Data
Freescale Semiconductor
35XS3500
5
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