AD8278BRZ-RL データシートの表示（PDF） - Analog Devices

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AD8278BRZ-RL

Low Power, Wide Supply Range, Low Cost Difference Amplifiers, G = ½, 2

Analog Devices 

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Supply Voltage

Maximum Voltage at Any Input Pin

Minimum Voltage at Any Input Pin

Storage Temperature Range

Specified Temperature Range

Package Glass Transition Temperature (TG)

Rating

±18 V

−VS + 40 V

+VS − 40 V

−65°C to +150°C

−40°C to +85°C

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

The θJA values in Table 7 assume a 4-layer JEDEC standard

board with zero airflow.

Table 7. Thermal Resistance

Package Type

θJA

8-Lead MSOP

135

8-Lead SOIC

121

14-Lead SOIC

105

Unit

°C/W

°C/W

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the AD8278 and

AD8279 are limited by the associated rise in junction tempera-

ture (TJ) on the die. At approximately 150°C, which is the glass

transition temperature, the properties of the plastic change.

Even temporarily exceeding this temperature limit may change

the stresses that the package exerts on the die, permanently shifting

the parametric performance of the amplifiers. Exceeding a

temperature of 150°C for an extended period may result in a

loss of functionality.

AD8278/AD8279

2.0

TJ MAX = 150°C

1.6

SOIC

1.2

θJA = 121°C/W

MSOP

θJA = 135°C/W

0.8

0.4

0

–50 –25

0

25

50

75

100 125

AMBIENT TEMERATURE (°C)

Figure 3. Maximum Power Dissipation vs. Ambient Temperature

SHORT-CIRCUIT CURRENT

The AD8278 and AD8279 have built-in, short-circuit protection

that limits the output current (see Figure 29 for more information).

While the short-circuit condition itself does not damage the

part, the heat generated by the condition can cause the part to

exceed its maximum junction temperature, with corresponding

negative effects on reliability. Figure 3 and Figure 29, combined

with knowledge of the supply voltages and ambient temperature of

the part, can be used to determine whether a short circuit will

cause the part to exceed its maximum junction temperature.

ESD CAUTION

Rev. C | Page 7 of 24

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