AD9508(RevA) データシートの表示（PDF） - Analog Devices
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AD9508 Datasheet PDF : 40 Pages
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AD9508
ABSOLUTE MAXIMUM RATINGS
Table 10.
Parameter
Supply Voltage (VDD)
Maximum Digital Input Voltage
CLK and CLK
Maximum Digital Output Voltage
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering 10 sec)
Junction Temperature
Rating
3.6 V
−0.5 V to VDD + 0.5 V
−0.5 V to VDD + 0.5 V
−0.5 V to VDD + 0.5 V
−65°C to +150°C
−40°C to +85°C
300°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
The following equation determines the junction temperature on
the application PCB:
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the customer at
the top center of the package.
ΨJT is the value as indicated in Table 11.
PD is the power dissipation.
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order approxi-
mation of TJ by the following equation:
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
Data Sheet
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Values of θJB are provided for package comparison and PCB
design considerations.
THERMAL CHARACTERISTICS
Thermal characteristics established using JEDEC51-7 and
JEDEC51-5 2S2P test boards.
Table 11. Thermal Characteristics, 24-Lead LFCSP
Thermal Characteristic
(JEDEC51-7 and JEDEC51-5 2S2P
Symbol Test Boards1)
Value2 Unit
θJA
Junction-to-ambient thermal
43.5 °C/W
resistance per JEDEC JESD51-2 (still
air)
θJMA
Junction-to-ambient thermal
40
°C/W
resistance, 1.0 m/sec airflow per
JEDEC JESD51-6 (moving air)
θJMA
Junction-to-ambient thermal
38.5 °C/W
resistance, 2.5 m/sec airflow per
JEDEC JESD51-6 (moving air)
θJB
Junction-to-board thermal
16.2 °C/W
resistance per JEDEC JESD51-8 (still
air)
θJC
Junction-to-case thermal resistance 7.1
°C/W
(die-to-heat sink) per MIL-STD-883,
Method 1012.1
ΨJT
Junction-to-top-of-package
0.33 °C/W
characterization parameter per
JEDEC JESD51-2 (still air)
1 The exposed pad on the bottom of the package must be soldered to ground
(VSS) to achieve the specified thermal performance.
2 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal
performance for actual applications requires careful inspection of the
conditions in the application to determine if they are similar to those
assumed in these calculations.
ESD CAUTION
Rev. A | Page 10 of 40
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