APL5508-37AC データシートの表示（PDF） - Anpec Electronics
部品番号
コンポーネント説明
メーカー
APL5508-37AC Datasheet PDF : 13 Pages
| |||
APL5508/5508R/5509/5509R
Classification Reflow Profiles(Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Tem peratures
Package Thickness
Volume mm3
Volume mm3
<350
≥350
<2.5 mm
240 +0/-5°C
225 +0/-5°C
≥2.5 mm
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Tem peratures
Package Thickness
Volume mm3
Volume mm3
Volume mm3
<350
350-2000
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process com patibility up to and
including the stated classification temperature (this m eans Peak reflow tem perature +0°C.
For example 260°C+0°C) at the rated MSL level.
R eliab ility test p rog ram
Test item
SO LD ER A BILITY
H O LT
PCT
TST
ESD
Latch-U p
M ethod
M IL-S T D -883D -2003
M IL-S T D -883D -1005.7
JESD-22-B, A102
M IL -S T D -8 83 D -1 0 11 .9
M IL-S T D -883D -3015.7
JESD 78
D escription
245°C , 5 SEC
1000 H rs Bias @ 125 °C
168 Hrs, 100 % RH , 121°C
-6 5°C ~ 1 5 0°C , 20 0 C yc le s
V H B M > 2K V, V M M > 200V
10m s , Itr > 1 00m A
Carrier Tape
t
Po
P
D
E
P1
F
Bo
W
Ko
Ao
D1
Copyright ANPEC Electronics Corp.
12
Rev. A.6 - Mar., 2004
www.anpec.com.tw
Share Link: 