BCX 54 /55 /56
Maximum Ratings (@ TA = +25°C, unless otherwise specified.)
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Pulse Collector Current
Continuous Base Current
Peak Pulse Base Current
Symbol
VCBO
VCEO
VEBO
IC
ICM
IB
IBM
BCX54
BCX55
BCX56
Unit
45
60
100
V
45
60
80
V
6
V
1
1.5
A
100
mA
200
Thermal Characteristics
Characteristic
Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Leads (Note 7)
Operating and Storage Temperature Range
Symbol
PD
RθJA
RθJL
TJ, TSTG
Value
1
124
10.0
-65 to +150
Unit
W
°C/W
°C/W
°C
Notes:
6. For a device surface mounted on 25mm X 25mm FR4 PCB with high coverage of single sided 1 oz copper, in still air conditions; the device is measured
when operating in a steady-state condition.
7. Thermal resistance from junction to solder-point (on the exposed collector pad).
Thermal Characteristics
120
100
25mm x 25mm 1oz Cu
Tamb = 25°C
80
D=0.5
60
40 D=0.2
Single Pulse
20
D=0.05
D=0.1
0
100µ 1m 10m 100m 1 10 100 1k
Pulse Width (s)
Transient Thermal Impedance
1.0
25mm x 25mm 1oz Cu
0.8
0.6
0.4
0.2
0.0
0 20 40 60 80 100 120 140 160
Temperature (°C)
Derating Curve
100
10
25mm x 25mm 1oz Cu
Tamb = 25°C
Single pulse
1
100µ 1m 10m 100m 1 10 100 1k
Pulse Width (s)
Pulse Power Dissipation
BCX 54 / 55 / 56
Datasheet Number: DS35369 Rev. 5 – 2
2 of 6
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October 2012
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