EL5325A データシートの表示（PDF） - Intersil
部品番号
コンポーネント説明
メーカー
EL5325A Datasheet PDF : 12 Pages
| |||
Typical Performance Curves (Continued)
M=400µs/DIV
5V
0V
5V
0V
200mV
SCLK
SDA
OUTPUT
EL5325A
0V
M=400µs/DIV
OUTPUT
SCLK
SDA
FIGURE 7. SMALL SIGNAL RESPONSE (RISING FROM 0V
TO 200mV)
FIGURE 8. SMALL SIGNAL RESPONSE (FALLING FROM
200mV TO 0V)
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0.9
833mW
0.8
0.7
0.6
0.5
θJA =1T2S0S°OCP/W28
0.4
0.3
0.2
0.1
0
0
25
50
75 85 100
125
AMBIENT TEMPERATURE (°C)
FIGURE 9. POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE
THERMAL CONDUCTIVITY TEST BOARD
1
0.9
0.8 909mW
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
25 50 75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 11. POWER DISSIPATION vs AMBIENT
TEMPERATURE
5
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.4
1.333W
1.2
1
0.8
θJA =7T5S°SCO/WP28
0.6
0.4
0.2
0
0
25
50
75 85 100
125
AMBIENT TEMPERATURE (°C)
FIGURE 10. POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-7 HIGH EFFECTIVE
THERMAL CONDUCTIVITY TEST BOARD -
HTSSOP EXPOSED DIEPAD SOLDERED
TO PCB PER JESD51-5
3.5
3 3.333W
2.5
2
1.5
1
0.5
0
0
25 50 75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 12. POWER DISSIPATION vs AMBIENT
TEMPERATURE
Share Link: 