EVPAD データシートの表示（PDF） - Panasonic Corporation
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コンポーネント説明
メーカー
EVPAD Datasheet PDF : 2 Pages
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■ Dimensions in mm (not to scale)
EVPADK04K
(Embossed Taping)
9.8
0.8
A1
B1
A2
LED implementation position
φ4φ.24.5
A3
B2
A4
LED implementation area
Light Touch Switches/EVPAD
10.35+–00.4
11.3±0.1
8.4±0.1
A1
A3
A1,A2,A3,A4
B1,B2
B1
B2
A2
A4
Circuit Diagram
PWB land pattern for reference
(Precautions for pattern design)
✽ Note that the terminals are exposed at the sections shaded with "
"
✽ Establish electrical connection at A1, A2, A3, and A4 to improve the contact performance.
■ Recommended Reflow Soldering Conditions
MAX.
260
230
180
150
Fan or Normal Temp.
● Embossed Carrier Taping
Tape width=12.0 mm
t1
Feeding hole
φD0
A
Chip pocket
P2 P0
t2
1
Chip component
P1 Tape running direction
(Normal Temp.)
Part No.
EVPAD
Height
4.6
The delivered carrier tape shape is either 1 or 2.
90 to 30
Soldering Time (s)
40 to 10
t2
2
t3
A
B
W
F
E
P1
P2
10.7±0.2 10.7±0.2 16.0±0.3 7.5±0.1 1.75±0.10 12.0±0.1 2.0±0.1
Dimension t3 only applies to shape 2.
P0
4.0±0.1
D0 Dia
t1
t2
1.5+_00.1 0.40±0.05 4.8±0.2
Unit: mm
t3
5.8±2.0
● Standard Reel Dimensions in mm (not to scale)
T
E
C
r
D
Item
A
B
C
D
Rate (mm) φ380.0±2.0 φ80.0±1.0 φ13.0±0.5 φ21.0±1.0
E
2.0±0.5
Item
W
T
t
r
Rate (mm) 17.5±0.5 21.5±1.0
—
—
A
Wt
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Sep. 2010
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