HFA1130ML データシートの表示（PDF） - Intersil
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HFA1130ML Datasheet PDF : 19 Pages
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Burn-In Circuits
HFA1130/883
HFA1130MJ/883 CERAMIC DIP
R3
1
8
R2
2
-
7
R1
3
+
6
D4
V-
4
5
D2
C2
D3
V+
C1 D1
NOTES:
R1 = R2 = 1kΩ, ±5% (Per Socket)
R3 = 10kΩ, ±5% (Per Socket)
C1 = C2 = 0.01µF (Per Socket) or 0.1µF (Per Row) Minimum
D1 = D2 = 1N4002 or Equivalent (Per Board)
D3 = D4 = 1N4002 or Equivalent (Per Socket)
V+ = +5.5V ± 0.5V
V- = -5.5V ± 0.5V
HFA1130ML/883 CERAMIC LCC
R3
3 2 1 20 19
R2
4
18
5
-
17
6
16
R1
+
7
15
8
14
9 10 11 12 13
D4
V-
D2
C2
D3
V+
C1 D1
NOTES:
R1 = R2 = 1kΩ, ±5% (Per Socket)
R3 = 10kΩ, ±5% (Per Socket)
C1 = C2 = 0.01µF (Per Socket) or 0.1µF (Per Row) Minimum
D1 = D2 = 1N4002 or Equivalent (Per Board)
D3 = D4 = 1N4002 or Equivalent (Per Socket)
V+ = +5.5V ± 0.5V
V- = -5.5V ± 0.5V
Spec Number 511082-883
210
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