HI-8585 データシートの表示（PDF） - Holt Integrated Circuits

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HI-8585

ARINC 429 Line Driver

Holt Integrated Circuits 

HI-8585 / HI-8586 PACKAGE DIMENSIONS

8-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB

(Narrow Body, Thermally Enhanced)

inches (millimeters)

Package Type: 8HNE

Top View

.194 ± .004

(4.92 ± .09)

.0085 ± .0015

(.216 ± .038)

Bottom View

.140 ± .01

(3.56 ± .26)

.236 ± .008

(5.99 ± .21)

PIN 1

.154 ± .004

(3.90 ± .09)

.100 ± .01

(2.54 ± .25)

BSC = “Basic Spacing between Centers”

is theoretical true position dimension and

has no tolerance. (JEDEC Standard 95)

.0165 ± .003

(.419 ± .089)

.050 BSC

(1.27)

SEE DETAIL A

.055 ± .005

(1.397 ± .127)

0° to 8°

Electrically isolated metal

heat sink on bottom of

package

Connect to any ground or

power plane for optimum

thermal dissipation

.033 ± .017

(.838 ± .432)

.0025 ± .002

(.064 ± .038)

DETAIL A

8-PIN PLASTIC SMALL OUTLINE (SOIC) - NB

(Narrow Body)

.194 ± .004

(4.92 ± .09)

.236 ± .008

(5.99 ± .21)

PIN 1

.154 ± .004

(3.90 ± .09)

.0165 ± .003

(.419 ± .089)

inches (millimeters)

Package Type: 8HN

.0085 ± .0015

(.216 ± .038)

See Detail A

.055 ± .005

(1.397 ± .127)

BSC = “Basic Spacing between Centers”

is theoretical true position dimension and

has no tolerance. (JEDEC Standard 95)

.050 BSC

(1.27)

0° to 8°

.033 ± .017

(.838 ± .432)

.0069 ± .003

(.1753 ± .074)

Detail A

HOLT INTEGRATED CIRCUITS

8

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