HPL1117
Package Reflow Conditions
pkg. thickness ≥ 2.5mm
and all bgas
Convection 220 +5/-0°C
VPR 215-219°C
IR/Convection 220 +5/-0°C
pkg. thickness < 2.5mm
and pkg. volume ≥ 350mm3
pkg. thickness < 2.5mm and pkg.
volume < 350mm3
Convection 235 +5/-0°C
VPR 235 +5/-0°C
IR/Convection 235 +5/-0°C
Reliability test program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B, A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245°C , 5 SEC
1000 Hrs Bias @ 125 °C
168 Hrs, 100 % RH , 121°C
-65°C ~ 150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms , Itr > 100mA
Carrier Tape & Reel Dimension
t
E
Po
P
D
P1
F
Bo
W
Ao
D1
Ko
T2
J
C
A
B
T1
Copyright HIPAC Semiconductor, Inc.
18
Rev. B.13 - Mar., 2004
www.hipacsemi.com