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HSDL-3203 データシートの表示(PDF) - HP => Agilent Technologies

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HSDL-3203 Datasheet PDF : 19 Pages
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Appendix A : SMT Assembly Application Note
1.0 Solder Pad, Mask and Metal Solder Stencil Aperture
STENCIL
APERTURE
METAL STENCIL
FOR SOLDER PASTE
PRINTING
SOLDER
MASK
Figure 14. Stencil and PCBA.
LAND
PATTERN
PCBA
1.1 Recommended Land Pattern
MOUNTING
CENTER
0.10
CL
1.35
SHIELD
SOLDER PAD
1.25
2.05
1.75
0.60
UNIT: mm
0.775
0.475
1.425
2.375
3.325
FIDUCIAL
Figure 15. Land pattern.
11

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