L4993
4.2
SO-20 thermal data
Figure 32. SO-20 PC board
Package and PCB thermal data
Note:
Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm,PCB
thickness = 2mm, Cu thickness=35µm , Copper areas: from minimum pad lay-out to 6cm2).
Figure 33. Rthj-amb Vs. PCB copper area in open box free air condition
70
68
66
64
62
60
58
56
54
52
50
0
1
2
3
4
5
6
7
PCB Cu heatsink area (cm^2)
21/30