LPC1776 データシートの表示（PDF） - NXP Semiconductors.

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LPC1776

32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 96 kB SRAM; USB Device/Host/OTG; Ethernet; LCD; EMC

NXP Semiconductors. 

NXP Semiconductors

Footprint information for reflow soldering of TFBGA180 package

Hx

P

P

LPC178x/7x

32-bit ARM Cortex-M3 microcontroller

SOT570-3

Hy

see detail X

solder land (SL)

solder paste deposit (SP)

solder land plus solder paste

solder resist opening (SR)

occupied area

Dimensions in mm

P

SL

SP

SR

Hx

Hy

0.80 0.40 0.40

Issue date

14-01-30

15-08-27

0.50 12.30 12.30

Recommend stencil thickness: 0.1 mm

Fig 46. Reflow soldering of the TFBGA180 package

SL = SP

SR

detail X

sot570-3_fr

LPC178X_7X

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 5.5 — 26 April 2016

© NXP Semiconductors N.V. 2016. All rights reserved.

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