LT1460GCZ-10-PBF データシートの表示（PDF） - Linear Technology

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LT1460GCZ-10-PBF

Micropower Precision Series Reference Family

Linear Technology 

LT1460

Applications Information

Input Capacitance

It is recommended that a 0.1µF or larger capacitor be

added to the input pin of the LT1460. This can help with

stability when large load currents are demanded.

Output Accuracy

Like all references, either series or shunt, the error budget of

the LT1460-2.5 is made up of primarily three components:

initial accuracy, temperature coefficient and load regulation.

Line regulation is neglected because it typically contrib-

utes only 30ppm/V, or 75µV for a 1V input change. The

LT1460-2.5 typically shifts less than 0.01% when soldered

into a PCB, so this is also neglected (see PC Board Layout

section). The output errors are calculated as follows for a

100µA load and 0°C to 70°C temperature range:

LT1460AC

Initial accuracy = 0.075%

For IO = 100µA, and using the LT1460-2.5 for calculation,

( )( ) ΔVOUT

=





3500ppm

mA 

0.1mA

2.5V

= 875µV

which is 0.035%.

For temperature 0°C to 70°C the maximum ΔT = 70°C,

( )( ) ΔVOUT

=

 10ppm

 °C 

70°C

2.5V

= 1.75mV

which is 0.07%.

Total worst-case output error is:

0.075% + 0.035% + 0.070% = 0.180%.

Table 1 gives worst-case accuracy for the LT1460AC, CC,

DC, FC, GC from 0°C to 70°C and the LT1460BI, EI, GI

from –40°C to 85°C.

Note that the LT1460-5 and LT1460-10 give identical ac-

curacy as a fraction of their respective output voltages.

PC Board Layout

In 13- to 16-bit systems where initial accuracy and tem-

perature coefficient calibrations have been done, the me-

chanical and thermal stress on a PC board (in a cardcage

for instance) can shift the output voltage and mask the

true temperature coefficient of a reference. In addition,

the mechanical stress of being soldered into a PC board

can cause the output voltage to shift from its ideal value.

Surface mount voltage references (MS8 and S8) are the

most susceptible to PC board stress because of the small

amount of plastic used to hold the lead frame.

A simple way to improve the stress-related shifts is to

mount the reference near the short edge of the PC board,

or in a corner. The board edge acts as a stress boundary,

or a region where the flexure of the board is minimum.

The package should always be mounted so that the leads

absorb the stress and not the package. The package is

generally aligned with the leads parallel to the long side

of the PC board as shown in Figure 20a.

A qualitative technique to evaluate the effect of stress on

voltage references is to solder the part into a PC board and

Table 2. Worst-Case Output Accuracy Over Temperature

IOUT LT1460AC LT1460BI LT1460CC LT1460DC LT1460EI

0

0.145% 0.225% 0.205% 0.240% 0.375%

100µA 0.180% 0.260% 0.240% 0.275% 0.410%

10mA 0.325% 0.405% 0.385% 0.420% 0.555%

20mA 0.425%

N/A

0.485% 0.520%

N/A

LT1460FC

0.325%

0.360%

0.505%

0.605%

LT1460GC

0.425%

0.460%

0.605%

0.705%

LT1460GI

0.562%

0.597%

0.742%

N/A

LT1460HC

0.340%

0.380%

0.640%

0.540%

LT1460JC

0.540%

0.580%

0.840%

0.740%

LT1460KC

0.850%

0.890%

1.15%

1.05%

1460fc

19

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