Revision History
REV DATE DESCRIPTION
A 3/10 Changes to Features
Add BGA Package to Pin Configuration, Order Information and Package Description Sections
Changes to LGA Package in Pin Configuration Section
Update to Pin Functions
Update to RF, Magnetic Field Immunity Section
“PCB Layout Isolation Considerations” Section Replaced
B 3/11 H-Grade parts added. Reflected throughout the data sheet.
C 1/12 MP-Grade parts added. Reflected throughout the data sheet.
D 11/12 Storage temperature range updated.
E 5/14 Removed H-grade and MP-grade parts throughout the data sheet.
Reduced Maximum Internal Operating Temperature and Storage Temperature Range.
Added CTI and DTI parameters.
F 9/14 Revised Output Supply Short-Circuit Current (ICC2)
LTM2882
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2, 15
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13
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1-24
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