MA4E2514 データシートの表示（PDF） - M/A-COM Technology Solutions, Inc.

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MA4E2514

SURMOUNT™ Low and Medium Barrier Silicon Schottky Diodes: Tee Pair

M/A-COM Technology Solutions, Inc. 

MA4E2514 Series

SURMOUNTTM Low and Medium Barrier Silicon

Schottky Diodes: Tee Pair

Electrical Specifications @ 25°C (Measured as Single Diodes) 1,2,3

M/A-COM Products

Rev. V5

Model Number

Type

Recommended Vf @ 1 mA Vb @ 10 uA

Freq. Range

(mV)

(V)

MA4E2514L

MA4E2514M

Low Barrier

DC - 18 GHz

Medium Barrier DC - 18 GHz

330 Max

300 Typ

470 Max

400 Typ

3 Min

5 Typ

3 Min

5 Typ

Ct @ 0 V

(pF)

0.12 Max

0.10 Typ

0.12 Max

0.10 Typ

Rt Slope Resistance

(Vf1– Vf2)/

(10.5 mA - 9.5 mA)

(Ω)

16 Typ

20 Max

12 Typ

18 Max

1. Rt is the dynamic slope resistance where Rt = Rs + Rj, where Rj = 26 / Idc (Idc is in mA) and Rs is the ohmic resistance.

2. Max Forward Voltage Difference Δ Vf @ 1 mA: 10 mV

3. Max Total Capacitance Difference Δ Ct @ 0 V: 0.03 pF

Absolute Maximum Ratings 4

Parameter

Value

Applications

The MA4E2514 Family of Surmount Schottky diodes

are recommended for use in microwave circuits

through Ku band frequencies for lower power applica-

tions such as mixers, sub-harmonic mixers, detectors

and limiters. The HMIC construction facilitates the

direct replacement of more fragile beam lead diodes

with the corresponding Surmount diode, which can be

connected to a hard or soft substrate circuit with sol-

der.

Operating Temperature

Storage Temperature

Forward Current

Reverse Voltage

RF C.W. Incident Power

RF & DC Dissipated Power

-40°C to +150°C

-40°C to +150°C

20 mA

5V

+ 20 dBm

50 mW

Handling

Electrostatic Discharge

( ESD ) Classification 5

Class 0

All semiconductor chips should be handled with care

to avoid damage or contamination from perspiration

and skin oils. The use of plastic tipped tweezers or

vacuum pickups is strongly recommended for individ-

ual components. The top surface of the die has a

protective polyimide coating to minimize damage.

The rugged construction of these Surmount devices

allows the use of standard handling and die attach

techniques. It is important to note that industry stan-

dard electrostatic discharge (ESD) control is required

at all times, due to the sensitive nature of Schottky

junctions. Bulk handling should insure that abrasion

and mechanical shock are minimized.

Die Bonding

Die attach for these devices is made simple through

the use of surface mount die attach technology.

Mounting pads are conveniently located on the bottom

surface of these devices, and are opposite the active

junction. The devices are well suited for high tem-

perature solder attachment onto hard substrates.

4. Exceeding any of these values may result in permanent dam-

age.

5. Human Body Model

Die Bonding

For Hard substrates, we recommend utilizing a vac-

uum tip and force of 60 to 100 grams applied uni-

formly to the top surface of the device, using a hot gas

bonder with equal heat applied across the bottom

mounting pads of the device. When soldering to soft

substrates, it is recommended to use a lead-tin inter-

face at the circuit board mounting pads. Position the

die so that its mounting pads are aligned with the cir-

cuit board mounting pads. Reflow the solder paste by

applying equal heat to the circuit at both die-mounting

pads. The solder joint must not be made one at a

time, creating unequal heat flow and thermal stress.

Solder reflow should not be performed by causing

heat to flow through the top surface of the die. Since

the HMIC glass is transparent, the edges of the

mounting pads can be visually inspected through the

die after the die attach is completed.

2

ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for

• North America Tel: 800.366.2266 / Fax: 978.366.2266

development. Performance is based on target specifications, simulated results, and/or prototype

measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-

ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macom.com for additional data sheets and product information.

been fixed. Engineering samples and/or test data may be available. Commitment to produce in

volume is not guaranteed.

M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or

information contained herein without notice.

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