MC144110P データシートの表示（PDF） - Freescale Semiconductor
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MC144110P Datasheet PDF : 12 Pages
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Packaging
14
1
N
-T-
SEATING
PLANE
H
8
B
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
6. 646-06 OBSOLETE, NEW STANDARD 646-07.
A
F
L
C
K
J
G
D 14 PL
M
(0.005) M
INCHES
DIM MIN MAX
A 0.715 0.770
B 0.240 0.260
C 0.145 0.185
D 0.015 0.021
F 0.040 0.070
G 0.100 BSC
H 0.052 0.095
J 0.008 0.015
K 0.115 0.135
L 0.290 0.310
M ---
10˚
N 0.015 0.040
Figure 9. Outline Dimensions for P SUFFIX, PLASTIC DIP
(CASE 646-07, Issue P)
PIN'S
NUMBER
1
PIN 1 INDEX
8
0.75
0.25
X45˚
0.25 M B
8X
10.55
10.05
2.65
A
2.35
16
0.25
0.10
0.49
16X 0.35
6
0.25 M T A B
A
7.6
7.4
5
4
10.45
10.15
A
9
B
14X
1.27
T
SEATING
PLANE
16X
0.1 T
0.32
0.23
1.0
0.4
7˚
0˚
SECTION A-A
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3. DATUMS A AND B TO BE DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
4. THIS DIMENSION DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURRS. MOLD
FLASH, PROTRUSION OR GATE BURRS SHALL
NOT EXCEED 0.15mm PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
5. THIS DIMENSION DOES NOT INCLUDE
INTER-LEAD FLASH OR PROTRUSIONS.
INTER-LEAD FLASH AND PROTRUSIONS
SHALL NOT EXCEED 0.25mm PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
6. THIS DIMENSION DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL NOT CAUSE
THE LEAD WIDTH TO EXCEED 0.62mm.
Figure 10. Outline Dimensions for DW SUFFIX, SOG
(CASE 751G-04, Issue D)
MC144110 Technical Data, Rev. 2
Freescale Semiconductor
11
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