MR27V1652F データシートの表示（PDF） - Oki Electric Industry

部品番号

コンポーネント説明

メーカー

MR27V1652F

1M–Word ×16–Bit or 2M–Word ×8–Bit Page Mode P2ROM

Oki Electric Industry 

OKI Semiconductor

PACKAGE DIMENSIONS

SOP44-P-600-1.27-K

FEDR27V1652F-02-02

MR27V1652F / P2ROM

(Unit: mm)

Mirror finish

5

Package material

Lead frame material

Pin treatment

Package weight (g)

Rev. No./Last Revised

Epoxy resin

42 alloy

Solder plating (≥5µm)

2.10 TYP.

4/Dec. 5, 1996

Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,

package name, pin number, package code and desired mounting conditions (reflow method, temperature and

times).

8/11

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