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NCP349 データシートの表示(PDF) - ON Semiconductor

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NCP349 Datasheet PDF : 13 Pages
First Prev 11 12 13
NCP349
PACKAGE DIMENSIONS
DFN6, 1.6x2, 0.5P
CASE 506BM01
ISSUE O
D
A
B
PIN ONE
REFERENCE
2X
0.10 C
ÉÉÉÉÉÉ
E
2X
0.10 C
TOP VIEW
0.05 C
DETAIL B
(A3)
0.05 C
NOTE 4
SIDE VIEW A1
L
L
L1
DETAIL A
OPTIONAL
CONSTRUCTIONS
ÇÇÉÇÇÉÇÇÉ EXPOSED Cu
MOLD CMPD
A3
A
A1
DETAIL B
OPTIONAL
CONSTRUCTION
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.20 0.40
D 1.60 BSC
D2 1.10 1.30
E 2.00 BSC
E2 0.95 1.15
e 0.50 BSC
K 0.20 −−−
L 0.15 0.35
L1 −−− 0.10
C
SEATING
PLANE
MOUNTING FOOTPRINT
DETAIL A
D2
1
3
6X L
1.30
E2
K6
5
e
BOTTOM VIEW
6X b
0.10
0.05
CAB
C NOTE 3
6X
0.43
1.15 2.30
1
6X
0.36
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
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12
NCP349/D

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