NCP694
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage
Vin
6.5
V
Enable Voltage
VCE
−0.3 to Vin
V
Output Voltage
Vout
−0.3 to Vin + 0.3
V
Power Dissipation SOT−89−5
PD
900
mW
Power Dissipation HSON−6
PD
900
mW
Operating Junction Temperature
TJ
+150
°C
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−55 to +125
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per JEDEC
Machine Model Method 200 V
THERMAL CHARACTERISTICS
Rating
Symbol
Test Conditions
Typical Value Unit
Junction−to−Ambient SOT−89−5
RqJA
1 oz Copper Thickness, 100 mm2
111
°C/W
Power Dissipation SOT−89−5
Junction−to−Ambient HSON−6
PD
900
RqJA
1 oz Copper Thickness, 100 mm2
111
mW
°C/W
Power Dissipation HSON−6
PD
900
mW
NOTE: Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following
boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12.
http://onsemi.com
3