AD8509/AD8511
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage
Input Voltage
Storage Temperature Range
RU Package
Operating Temperature Range
Junction Temperature Range
RU Package
Lead Temperature Range
(Soldering, 60 sec)
Rating
7V
GND to VS
−65°C to +150°C
−40°C to +85°C
−65°C to +150°C
300°C
Table 4. MUX Function
A/B Select (Pin 29)
Logic High
Logic Low
Input
INAx
INBx
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; the functional operation of the device at these or
any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may
affect device reliability.
Table 3.
Package Type
θJA1
θJC
Unit
48-lead Pb-free TSSOP (RU)
115
42
°C/W
1 θJA is specified for the worst-case conditions, that is, θJA is specified for
devices soldered in circuit boards for surface-mount packages.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. B | Page 4 of 8