Data Sheet
PACKAGING DIAGRAMS
Pin # 1 Identifier
2 Mbit / 4 Mbit / 8 Mbit Multi-Purpose Flash
SST39LF200A / SST39LF400A / SST39LF800A
SST39VF200A / SST39VF400A / SST39VF800A
12.20
11.80
1.05
0.95
0.50
BSC
0.27
0.17
18.50
18.30
0.15
0.05
0.70
0.50
20.20
19.80
1.20
max.
Note: 1. Complies with JEDEC publication 95 MO-142 DD dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
DETAIL
0˚- 5˚
0.70
0.50
1mm
48-tsop-EK-8
48-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) 12MM X 20MM
SST PACKAGE CODE: EK
©2003 Silicon Storage Technology, Inc.
28
S71117-07-000
11/03