Philips Semiconductors
LCD controllers/drivers
Product specification
PCF2119X
handbook, full pagewidth
x
y
A
1, 1
2, 1
3, 1
x, 1
1, 2
2, 2
1, 3
F
D
B
1, y
x, y
E
MGR977
handbook, halfpage
PC2119-2
Fig.41 Tray details.
MGR978
Table 20 Dimensions for Fig.41
DIM.
A
B
C
D
E
F
x
y
DESCRIPTION
pocket pitch, x direction
pocket pitch, y direction
pocket width, x direction
pocket width, y direction
tray width, x direction
tray width, y direction
number of pockets in x
direction
number of pockets in y
direction
The orientation of the IC in a pocket is indicated by the position of the
IC type name on the die surface with respect to the chamfer on the
upper left corner of the tray. Refer to the bonding pad location
diagram for the orientating and position of the type name on the die
surface.
Fig.42 Tray alignment.
2003 Jan 30
61
VALUE
10.16 mm
4.45 mm
7.74 mm
1.91 mm
50.8 mm
50.8 mm
4
10