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ST72254G2B3 データシートの表示(PDF) - STMicroelectronics

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ST72254G2B3 Datasheet PDF : 135 Pages
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ST72104G, ST72215G, ST72216G, ST72254G
14.2 THERMAL CHARACTERISTICS
Symbol
RthJA
PD
TJmax
Ratings
Package thermal resistance (junction to ambient)
SDIP32
SO28
Power dissipation 1)
Maximum junction temperature 2)
Value
60
75
500
150
Unit
°C/W
mW
°C
Notes:
1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD)
and PPORT is the port power dissipation determined by the user.
2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.
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