RT8206L/M
Absolute Maximum Ratings (Note 1)
z VIN, ENLDO to GND -------------------------------------------------------------------------------------------- –0.3V to 30V
z PHASEx to GND
DC ------------------------------------------------------------------------------------------------------------------- −0.3V to 30V
<20ns -------------------------------------------------------------------------------------------------------------- −8V to 38V
z BOOTx to PHASEx --------------------------------------------------------------------------------------------- −0.3V to 6V
z VCC, ENx, SKIP, TON, PVCC, PGOODx, to GND ----------------------------------------------------- −0.3V to 6V
z LDO, FBx, VOUTx, SECFB, REF, ILIMx to GND -------------------------------------------------------- −0.3V to (VCC + 0.3V)
z UGATEx to PHASEx
DC ------------------------------------------------------------------------------------------------------------------- −0.3V to (PVCC + 0.3V)
<20ns -------------------------------------------------------------------------------------------------------------- −5V to 7.5V
z LGATEx, BYP to GND
DC ------------------------------------------------------------------------------------------------------------------- −0.3V to (PVCC + 0.3V)
<20ns -------------------------------------------------------------------------------------------------------------- −2.5V to 7.5V
z PGND to GND ---------------------------------------------------------------------------------------------------- −0.3V to 0.3V
z Power Dissipation, PD @ TA = 25°C
WQFN-32L 5x5 -------------------------------------------------------------------------------------------------- 2.778W
z Package Thermal Resistance (Note 2)
WQFN-32L 5x5, θJA --------------------------------------------------------------------------------------------- 36°C/W
WQFN-32L 5x5, θJC -------------------------------------------------------------------------------------------- 6°C/W
z Junction Temperature ------------------------------------------------------------------------------------------- 150°C
z Lead Temperature (Soldering, 10 sec.) --------------------------------------------------------------------- 260°C
z Storage Temperature Range ---------------------------------------------------------------------------------- −65°C to 150°C
z ESD Susceptibility (Note 3)
HBM (Human Body Model) ------------------------------------------------------------------------------------ 2kV
Recommended Operating Conditions (Note 4)
z Input Voltage, VIN ----------------------------------------------------------------------------------------------- 6V to 25V
z Junction Temperature Range ---------------------------------------------------------------------------------- −40°C to 125°C
z Ambient Temperature Range ---------------------------------------------------------------------------------- −40°C to 85°C
Copyright ©2012 Richtek Technology Corporation. All rights reserved.
DS8206L/M-07 June 2012
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
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