SC7422
There is the formula of heat sinking for the SC7422:
șJA = (TJ(max) -TA )/ PDISS
Where șJA is the thermal resistance from junction to ambient, TJ(max) is the junction temperature, TA is ambient
temperature, PDISS is the power dissipation.
If the junction temperature remains below 150°C but the ambient temperature has reached to 50°C, the total
junction-to-ambient thermal resistance must be less than©JA calculated as follows:
șJA = (150°C - 50°C) / 2.6W =38.4°C/W.
Using șJC=26°C /W, the heat-sink thermal resistance must be less than:
șJA - șJC = 12.4°C/W
So the SC7422 doesn’t need heat sink in the normal operation. In application, the copper foil which connects
GND on PCB can be utilized for heat sinking to maintain proper operation temperature.
TYPICAL APPLICATION CIRCUIT
HANGZHOU SILAN MICROELECTRONICS CO.,LTD
Http: www.silan.com.cn
REV:1.0 2006.11.13
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