STPS16170CB-TR データシートの表示（PDF） - STMicroelectronics
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STPS16170CB-TR Datasheet PDF : 10 Pages
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Package information
STPS16170C
Table 7. D2PAK dimensions
Dimensions
Ref. Millimeters
Inches
L2
L
L3
A
A
A1
E
C2
A2
B
D
B2
C
A1
C2
B2
B
G
C
R
D
E
G
A2
L
L2
M*
V2
L3
* FLAT ZONE NO LESS THAN 2mm
M
R
V2
Figure 13. D2PAK footprint (dimensions in mm)
Min. Max
4.40 4.60
2.49 2.69
0.03 0.23
0.70 0.93
1.14 1.70
0.45 0.60
1.23 1.36
8.95 9.35
10.00 10.40
4.88 5.28
15.00 15.85
1.27 1.40
1.40 1.75
2.40 3.20
0.40 typ.
0°
8°
Min. Max.
0.173 0.181
0.098 0.106
0.001 0.009
0.027 0.037
0.045 0.067
0.017 0.024
0.048 0.054
0.352 0.368
0.393 0.409
0.192 0.208
0.590 0.624
0.050 0.055
0.055 0.069
0.094 0.126
0.016 typ.
0°
8°
16.90
10.30
8.90
5.08
1.30
3.70
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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