STPS20L15D/G
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values).
IR(mA)
5E+2
1E+2
Tj=100°C
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
C(nF)
5.0
F=1MHz
Tj=25°C
1E+1
1.0
1E+0
Tj=25°C
VR(V)
1E-1
0.1
0 2 4 6 8 10 12 14 16
1
VR(V)
2
5
10
20
Fig. 7: Forward voltage drop versus forward Fig. 8: Forward voltage drop versus forward
current (typical values).
current (maximum values).
IFM(A)
200.0
100.0
Tj=125°C
10.0
1.0
Tj=75°C
Tj=25°C
0.1
0
VFM(V)
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
IFM(A)
200
Tj=100°C
100
10
VFM(V)
1
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
Fig. 9: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness : 35 µm).
(STPS20L15G only)
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
S(Cu) (cm²)
0
0 4 8 12 16 20 24 28 32 36 40
3/5