TS4601B データシートの表示（PDF） - STMicroelectronics

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TS4601B

High performance stereo headphone amplifier with capacitorless outputs and I2C bus interface

STMicroelectronics 

Package information

Figure 55. Marking (top view)

■ Logo: ST

■ Symbol for lead-free: E

■ Part number: B1

■ X digit: Assembly code

■ Date code: YWW

■ The dot marks pin A1

TS4601B

E

B1X

YWW

Figure 56. Flip-chip - 16 bumps

2100µm

500µm

500µm

2100µm

■ Die size: 2.1mm x 2.1mm ± 30µm

■ Die height (including bumps): 600µm

■ Bumps diameter: 315µm ±50µm

■ Bump diameter before reflew: 300µm

±10µm

■ Bump height: 250µm ±40µm

■ Die height: 350µm ±20µm

■ Pitch: 500µm ±50µm

■ Coplanarity: 60µm max

600µm

Figure 57. Device orientation in the tape pocket

1

A

8

1

A

26/28

Die size X + 70µm

4

All dimensions are in mm

User direction of feed

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