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TAPE AND REEL
Option 8
VO618A
Vishay Semiconductors
Fig. 20 - Default Orientation, 2000 units/reel
DESCRIPTION
Tape width
Pitch of spocket holes
Distance of compartment
Distance of compartment to compartment
SOLDER PROFILES
SYMBOL
W
P0
F
P2
P1
DIMENSIONS in mm (inch)
24 ± 0.3 (0.63)
4 ± 0.1 (0.15)
11.5 ± 0.1 (0.295)
2 ± 0.1 (0.079)
8 ± 0.1 (0.472)
300
5s
250 235 °C to
260 °C
200
first wave
wave
ca. 200 K/s
150
100 °C to
130 °C
100
Lead temperature
wseacvoend
ca. 2 K/s
full line: typical
dotted line:
process limits
2 K/s
ca. 5 K/s
50
forced cooling
0
0
94 8626
50
100
150 200 250
Time (s)
Fig. 21 - Wave Soldering Double Wave Profile According to
J-STD-020 for DIP-8 Devices
300
250 255 °C
240 °C
217 °C
200
max. 260 °C
245 °C
max. 30 s
150
max. 120 s
max. 100 s
100
max. ramp down 6 °C/s
50 max. ramp up 3 °C/s
0
0
50 100 150 200 250 300
19841
Time (s)
Fig. 22 - Lead (Pb)-free Reflow Solder Profile According to
J-STD-020 for SMD-8 Devices
HANDLING AND STORAGE CONDITIONS
ESD level: HBM class 2
Floor life: unlimited
Conditions: Tamb < 30 °C, RH < 85 %
Moisture sensitivity level 1, according to J-STD-020
Rev. 1.9, 27-Aug-15
9
Document Number: 83432
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000